Formation of silicide contacts using a sidewall oxide process

ABSTRACT

A method for formation of silicide structures on a semiconductor device. Oxide sidewalls are formed upon and selectively removed from polysilicon contacts. Refractory metal is deposited and heated, unreacted metal is removed, leaving a metal silicide on selected polysilicon sidewalls.

This is a division of application Ser. No. 503,336 filed Apr. 2, 1990,now U.S. Pat. No. 5,107,321.

BACKGROUND OF THE INVENTION

The present invention relates to the field of semiconductor devices andtheir manufacture. More specifically, in one embodiment the inventionprovides both bipolar and complementary metal-oxide semiconductor (CMOS)devices on a single substrate and a process for their fabrication.

Bipolar and CMOS devices and their fabrication have been well known formany years. Recently, the advantages of both types of devices have beenbeneficially incorporated into circuits using both types of devices on asingle substrate. Circuits which incorporate both bipolar and CMOSdevices have come to be known as "BiCMOS." BiCMOS devices offer theadvantages of the high packing density and low power consumption of CMOSdevices, as well as the high speed of bipolar devices. One BiCMOS deviceand process for fabrication thereof is described in U.S. Pat. No.4,764,480 (Vora), assigned to the assignee of the present invention andincorporated herein by reference for all purposes.

While meeting with some success, BiCMOS devices continue to have certainlimitations. For example, oxide encroachment in the isolation processreduces the packing density of the CMOS structures. Further, theisolation processes used in prior devices prevents close spacing of thetransistors due to the associated reduction in latchup immunity. Stillfurther, it has been necessary to provide a punchthrough implant inscaled MOS devices to prevent punchthrough. Still further, source/drainresistance and source/drain contact resistance has limited the currentdrive capability of the MOS transistors and the packing density of theCMOS structures has been limited by direct metal contacting of thesource/drain regions. Also, capacitance of the source/drain junctionlimits the AC performance of the CMOS structures.

Extrinsic base resistance is in some instances an important factor in ACperformance of bipolar structures. Still further, collector-substratejunction capacitance degrades the speed of bipolar circuits.

From the above it is seen that an improved BiCMOS device and method offabrication thereof is desired not only to provide devices with improvedperformance and reduced size, but also to provide devices which can befabricated more simply and economically.

SUMMARY OF THE INVENTION

An improved BiCMOS technology is disclosed. The invention providesdevices which have improved performance, reduced size, and/or which maybe fabricated more simply. The devices disclosed herein may be usedwith, for example, high performance Emitter Coupled Logic (ECL) standardcell designs, multiport 6 transistor memory cell, gate array designswith embedded memory, and the like.

According to one aspect of the invention, an improved method of forminggate oxide is provided. The method includes the steps of forming aninsulator region on a surface of a semiconductor substrate; forming afirst polysilicon layer on the insulator; forming a mask on portions ofthe polysilicon layer, the portions defining gate regions of the fieldeffect devices; and removing the polysilicon and the insulator from thesurface in regions not protected by the mask.

According to another aspect of the invention, an improved method ofadjusting the threshold voltage in a BiCMOS process is provided. A firstportion of the field effect devices has a channel region of a firstconductivity type, and a second portion of the field effect devices hasa channel region of a second conductivity type. The method includes thesteps of, in a substrate having a surface with first and second regions,implanting a first dopant in the first regions, the first dopant of thefirst conductivity type; implanting the first and second regions with asecond dopant, the second dopant of a second conductivity type, thefirst region having a net dopant concentration of the first conductivitytype; forming gate oxide regions on the first and second regions; andforming conductive gates on the gate oxide regions, the first regionscomprising the channel regions of a first conductivity type, the secondregions comprising the channel regions of a second conductivity type.

The invention also provides a method of forming a base region in bipolardevices and a channel region in field effect devices in a BiCMOSprocess. The method forms a semiconductor structure comprising fieldeffect devices and bipolar transistors, the bipolar transistors havingbase regions of a first conductivity type, at least a portion of thefield effect devices having channel regions of the first conductivitytype, and includes the steps of masking selected regions of thesemiconductor structure, the selected regions including at least thebase regions of the bipolar transistors; implanting the semiconductorstructure with a dopant of the first conductivity type to provide thechannel regions of the devices having first characteristics; forming apolysilicon layer over at least the base regions; masking secondselected regions of the semiconductor structure, the second selectedregions including at least the channel regions of the field effectdevices; implanting the polysilicon layer with a dopant of the firstconductivity type; and diffusing dopants from the polysilicon layer intounderlying silicon to provide at least a portion of the base regions ofthe bipolar transistors with second characteristics.

An overall method of forming n and p channel field effect devices in aBiCMOS structure is also provided. The substrate includes a first regionfor a bipolar transistor, a second region for an NMOS transistor, and athird region for a PMOS transistor. The method includes the steps of ina p-type semiconductor substrate, masking and implanting n-type dopantsfor formation of an n-type buried layer for the PMOS and bipolartransistors; masking and implanting p-type dopants for formation of ap-type buried layer for the NMOS transistor and p-type channel stopsadjacent the first region; forming an n-type epitaxial silicon layer onthe substrate; forming field oxide regions adjacent the first, secondand third regions, as well as between a sink and a base region of thefirst region; masking and implanting n-type dopants into the sink regionto a first dopant concentration; masking and implanting n-type dopantsinto the third region to a second dopant concentration; masking andimplanting p-type dopants into the second and third regions so as toadjust a threshold voltage of the NMOS and PMOS transistors; forming agate oxide layer on the epitaxial layer; forming a first layer ofpolysilicon on the gate oxide layer; masking and etching the first layerof polysilicon and the oxide layer to form gate oxide regions for theNMOS and PMOS transistors; forming a second layer of polysilicon on thefirst layer of polysilicon and the epitaxial layer; masking andimplanting n-type and p-type dopants into the second polysilicon layerand etching the polysilicon layer to form emitter, base, collectorcontacts for the bipolar transistor, source and drain contacts for theNMOS and PMOS transistors, and gate polysilicon regions for the NMOS andPMOS transistors; implanting n-type dopant to form a lightly dopeddiffusion in the NMOS transistor; masking and implanting boron to form alightly doped diffusion for PMOS and bipolar transistors; formingsidewall oxide on the emitter, base, collector contacts of the bipolartransistor, the source and drain contacts of the NMOS and PMOStransistors, and the gate polysilicon regions of the NMOS and PMOStransistors; masking the sidewall oxide on the emitter contact and thegate polysilicon regions, and removing sidewall oxide from exposedregions; implanting p-type dopants into the first and third regions;implanting n-type dopants into the second regions; forming a refractorymetal layer across at least the first, second and third regions andheating the substrate so as to form metal silicide where the refractorymetal contacts silicon; removing unreacted metal from at least thefirst, second, and third regions; and forming an interconnect system forthe NMOS, PMOS and bipolar transistors.

A further understanding of the nature and advantages of the inventionsherein may be realized by reference to the remaining portions of thespecification and the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-section of a BiCMOS structure according to oneembodiment of the invention;

FIGS. 2a to 2v illustrate fabrication of a BiCMOS device;

FIG. 3 illustrates I_(c) versus V_(ce) for a bipolar transistoraccording to one embodiment of the invention;

FIGS. 4a and 4b illustrate I_(d) versus V_(gs) for PMOS and NMOStransistors respectively; and

FIG. 5 illustrates a BiCMOS ring oscillator used in testing oneembodiment of the invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS CONTENTS

I. General

II. Fabrication Sequence of BiCMOS Devices

III. Device Performance

I. General

FIG. 1 illustrates a BiCMOS device in cross-section according to oneembodiment of the invention. The device includes a bipolar transistor 2(which in the embodiment shown in FIG. 1 is an NPN transistor), ann-channel MOSFET (NMOS transistor) 4 and a p-channel MOSFET (PMOStransistor) 6 in the same substrate. The NMOS transistor 4 and the PMOStransistor 6 are appropriately connected to form a CMOS structure 8.

The devices are fabricated on a substrate 10. In the embodiment shown inFIG. 1 the substrate is a p-substrate having a dopant concentration ofbetween about 1×10¹³ and 1×10¹⁶ with a preferred range of 2×10¹⁴ and3×10¹⁵ /cm³. A reduced pressure doped n-type epitaxial silicon is grownon top of the substrate, in which the devices are fabricated.

In most embodiments the NMOS transistor 4 is formed in a p+ tub or pwell 12 and the PMOS transistor 6 is formed in an n+ tub or n well 14.In preferred embodiments the n well 14 is graded and doped to aconcentration of between about 1×10¹⁶ and 2×10¹⁹ /cm³ with a preferredconcentration of about 2×10¹⁶ to 5×10¹⁶ /cm³. The p well 12 is gradedand doped to a general concentration of between about 1×10¹⁶ to 1×10¹⁸with a preferred range of about 5×10¹⁶ to 7×10¹⁷ /cm³, although a widerange of dopant concentrations may be used without departing from thescope of the invention. Wells 12 and 14 enable the complementaryconductivity devices to be formed on a single substrate.

The NPN transistor 2 is provided with a heavily doped buried layer 16and collector sink 17, which together provide a low resistanceconnection region between a collector contact 20 and the base 18. Inpreferred embodiments the buried layer 16 and sink 17 are doped to aconcentration or between about 1×10¹⁷ and 1×10²⁰ with a preferred rangeof about 5×10¹⁸ to 1×10²⁰ /cm³.

A p+ channel stop 19 is provided between the NPN transistor and adjacentdevices to prevent surface inversion of the lightly doped substratewhich would connect the buried layer 16 with adjacent devices. Betweenthe NMOS transistor 4 and the PMOS transistor 6, between the sink 17 andthe base 18, between the NPN and NMOS transistors, and between thetransistors shown in FIG. 1 and adjacent transistors, oxide isolationregions 22a, 22b, 22c, and 22d, respectively, are provided whichtypically will be, for example, SiO₂ for device isolation.

Along the surface of the device and formed from a single layer ofdeposited polycrystalline silicon (polysilicon), are a resistor 24, basecontact 26, emitter contact 27a, collector contact 20, NMOS draincontact 28, NMOS gate 30, NMOS source/well tap 32a, PMOS drain 32b, PMOSgate 34, and PMOS source/well tap contact 36. An emitter region 27b isdiffused into the monocrystalline epitaxial layer from emitter contact27a. It is to be recognized that while region 27a is referred to hereinas the emitter contact, this region is sometimes referred to by those ofskill in the art as an emitter. No difference in meaning is intended.

Thin gate oxide layers are provided beneath the NMOS and PMOS transistorgates, and sidewall oxide 42 is provided on the NMOS and PMOS gates. Inpreferred embodiments the NMOS gate is formed of heavily doped implantedn+ polysilicon, while the PMOS gate may be formed from n+ or p+implanted polysilicon. N-type dopants are preferred in the PMOS gatebecause n+ will provide a buried channel device, having a higher carriermobility, while p+ will provide a surface channel device. Sidewall oxide44 is also provided on the sidewalls of the bipolar emitter 27.

Metallic contacts (i.e., contacts containing metal) such as silicidecontacts 46 are formed on the p+ bipolar transistor base contacts 26.The silicide contact covers the upper portion of the base contact, thesidewall of the base contact, as well as the horizontal upper surface ofthe base region from the sidewall of the base contact up to the sidewalloxide of the emitter. A separate silicide contact 48 is provided alongthe top portion of the emitter 27 between the sidewall spacer oxideregions 44. The refractory metal contacts shown herein reduce theresistivity of the contacts and, therefore, increase the speed of thedevice.

Similarly, silicide contacts are provided for the poly collector contact20, the NMOS gate 30, the PMOS gate 34, and p+/n+ source and drainpolycrystalline contacts 28, 32, and 36. Like the contact for theemitter 27, the silicide contacts 50 and 52 for the NMOS and PMOS gates,respectively, extend only from sidewall oxide to sidewall oxide.Conversely, the silicide contacts 54a, 54b, 54c, and 54d for the NMOSand PMOS source and drain contacts cover the sidewall of the polysiliconcontacts and extend along the horizontal portion of the source/drain upto the sidewall oxide of the gates 30 and 34. The silicide 55 for thecollector contact covers the sidewalls of the contact down to fieldoxide regions 22b and 22c, as well as the upper surface of the collectorcontact.

The structure further includes a thick (0.8 to 1.3 and preferably about1.3 μm) oxide layer 56 to insulate the devices from metal layer 58, usedfor interconnection purposes. Tungsten plugs 80 may optionally beprovided to fill the apertures in the oxide layer 56 between the firstmetal layer and the various silicide regions. Additional metal/oxideinterconnect layers 82 may also be provided, topped by a passivationlayer 84.

II. Fabrication Sequence of BiCMOS Devices

FIGS. 2a through 2v illustrate fabrication of the BiCMOS devices shownin FIG. 1. In particular, FIG. 2a illustrates a cross-section of thedevices at a first stage of their fabrication. To reach this stage, thesubstrate was denuded, and a screen oxide layer was formed. The devicewas then masked for simultaneous implant of the n+ tub or well 14 andthe npn buried layer 16 with arsenic, antimony, or the like. The implantenergy used for formation of regions 14 and 16 is preferably about 50 to200 keV with a preferred range of between about 60 to 80 keV such thatthe dopant concentration of regions 14 and 16 is between about 5×10¹⁷ to2×10²⁰ with a preferred range of about 1×10¹⁹ and 1×10²⁰ /cm³. Theburied layers are then annealed and further oxidized. As shown, oxidewill grow somewhat thicker over the n+ regions.

After formation of the n+ regions 14 and 16, the device is then maskedas shown in FIG. 2b for simultaneous formation of the p+ channel stop 19and the NMOS tub or well 12. The implant energy used in formation of theregions 19 and 12 is preferably between about 50 to 200 keV with apreferred range of 140 to 200 keV such that the dopant concentration ofthe p+ buried layers is between about 1×10¹⁷ and 1×10¹⁸ /cm³. The p+regions preferably are doped with boron.

As shown in FIG. 2c, the channel stop mask and oxide are then removedand a doped n-type epitaxial silicon layer 21 having a thickness of, forexample, about 1.1 μm is grown across the surface of the substrate.After depositing sandwiched layers of thermal oxide and nitride, aphotoresist mask is then formed over the surface so as to expose theepitaxial silicon where oxide regions 22a, 22b, 22c, and 22d are to beformed and protect the active regions of the device. The oxide regionsare formed using the well known "SWAMI" process according to oneembodiment. The process may be modified by changing the silicon etchprocedure and depth, and by choosing different oxide/nitride/oxidesidewall layers.

In particular, according to one embodiment, the silicon is masked andetched to a depth of, e.g., about 3000 Å using a plasma etch as shown inFIG. 2d. The resist is then removed and a second thermal oxide layer (ofabout 400 Å), a second nitride layer (of about 600 Å), and a thirddeposited oxide layer (of about 1800 Å) are formed on the device. Asecond plasma etch is used to remove about 750 Å of additional siliconleaving the device substantially as shown in FIG. 2e. The remainingsidewall oxide is then removed and the substrate is then oxidized in ahigh pressure (e.g., 10 atmospheres) oxidation environment to grow thenecessary field oxide, leaving the device as shown in FIG. 2f.

Thereafter, the nitride is stripped and a grown screen oxide layerhaving a thickness of about 250 Å is formed on the surface of thesubstrate as shown in FIG. 2g. A mask is then formed, exposing only thesink region 17. As shown in FIG. 2h, a sink implant using an implantenergy of about 100 to 190 keV with a dose of between about 1×10¹⁴ and1×10¹⁶ using phosphorus as a dopant is then performed. The resultingdopant concentration in the sink region 17 is between about 1×10¹⁸ and1×10²⁰ /cm³. The sink mask is then removed and a separate mask/ionimplantation is performed to dope the well and channel regions of thePMOS transistor to a concentration of between about 1×10¹⁶ and 5×10¹⁶/cm³ using phosphorus as a dopant, also as shown in FIG. 2h. Inpreferred embodiments the implant energy used for the PMOS well regionis between about 50 and 200 keV with energy of between about 100 and 200keV preferred. The resulting net dopant concentration in the epitaxialchannel region of the n-well is between about 1×10¹⁶ and 5×10¹⁶ /cm³.The sink and n-well are then annealed and driven-in by heating with aconventional thermal cycle in nitrogen.

Thereafter, a mask is formed on the surface of the substrate whichexposes only the NMOS and PMOS transistor regions. This mask is used fora threshold voltage implant as shown in FIG. 2i. The implant is used toadjust the threshold voltage of the NMOS and PMOS transistors asnecessary, typically to between about |0.6| and |1.0| volts. Inpreferred embodiments the threshold voltage implant is an implant ofboron at a dose of between about 1×10¹³ to 5×10¹³ and preferably at 30to 60 KeV. The boron and the up-diffusing p+ from the p-well set thethreshold voltage for the NMOS transistor. The threshold voltage implantin conjunction with the n-well implant sets the PMOS threshold voltage.In preferred embodiments the threshold voltage implant ultimatelyprovides transistors with threshold voltages of 0.75±0.1 for NMOS and-0.85±0.1 for PMOS transistors.

Referring to FIG. 2j, the screen oxide then is stripped and a thin (onthe order of 135 to 165 Å) gate oxide layer 86 is grown using means wellknown to those of skill in the art. A thin (on the order of 400 to 600Å) layer of polysilicon 88 is then deposited on the thin gate oxidelayer and a mask 62 is formed on the poly layer to define the NMOS andPMOS gates. A plasma etch removes the undesired poly from all regions ofthe substrate except those over the NMOS and PMOS gate oxide regions.Next, a wet etch is used to remove the underlying oxide. Protection ofthe gate oxide by the thin poly layer provides MOS gates having farfewer defects since they are not exposed directly to photoresist.

FIG. 2k illustrates the next sequence of process steps. The gate oxidemask is removed and another layer of intrinsic polysilicon 64 having athickness of about 1,000 to 4,000 and preferably about 3,200 Å isdeposited across the entire surface of the substrate and a cap oxidelayer 66 is formed by thermal oxidation of the polysilicon layer 64. Thedevices are then masked with photoresist to expose at least the baseregion of the bipolar transistor and the lightly doped regions of theresistors. In some embodiments, only the NMOS and PMOS transistorregions are protected by the mask. A base implant is then performed asshown in FIG. 21 and the base is annealed. In preferred embodiments thebase implant uses an energy of between about 30 and 100 keV, with animplant energy of between about 30 and 50 preferred. The dose of thisimplant is preferably about 3×10¹³ and 8×10¹⁵. In preferred embodimentsthe anneal is performed by heating the structure to 900°-950° C. for30-60 minutes, and results in a p- base region having a thickness ofbetween about 1,000 and 2,000 Å with a dopant concentration of betweenabout 1×10¹⁸ and 1×10¹⁹ /cm³, with a dopant concentration of about5×10¹⁸ /cm³ preferred.

Thereafter, as illustrated in FIG. 2m, a mask is formed which exposesregions 70a, 70b, 70c, and 70d which will eventually be a portion of theresistor, the base contacts, and the contact 32. The regions arepreferably doped p+ to a concentration of between about 1×10¹⁹ and1×10²⁰ /cm³ with a dopant concentration of about 6×10¹⁹ /cm³ preferredusing boron. The p+ mask is removed and another mask is formed on thesurface of the device to expose regions 68a, 68b, and 68c which willeventually be used as the bipolar emitter, the bipolar collectorcontact, the source/drain contacts, and the gates of the MOStransistors. The regions 68 are doped n+ using an arsenic implant withan energy of about 100 keV to a concentration of between about 5×10¹⁹and 1×10²⁰ /cm³. As discussed above, the PMOS gate may be either n+ orp+ and thus may be included in either the n+ or p+ mask. A layer ofnitride 67 having a thickness of between about 1,000 and 1,200 Å is thendeposited for the purpose of preventing etch undercutting of theunderlying polysilicon, and preventing the link implant from going intogates and emitters. The polysilicon layer 64 is then annealed at 900° C.for a time of about 15 minutes.

Next, a mask is formed on the surface of the nitride to protect thebase, emitter, and collector contacts of the bipolar transistors and thesource, gate, and drains of the NMOS and PMOS transistors. A dry etchwith chlorine chemistry results in the structure shown in FIG. 2n. Asshown, the etch is conducted such that the bipolar base and theepitaxial region adjacent the gates of the MOSFETs are etched below theoriginal epitaxial surface by about 1,000 to 2,000 Å.

The next sequence of steps is illustrated in FIG. 2o. The etch mask isremoved. A lightly doped drain (LDD) implant is performed in which thesource and the drain of the NMOS transistor are lightly implanted withan n-type dopant such as phosphorus using an implant energy of betweenabout 20 and 50 keV with implant energies of between about 20 and 40 keVpreferred. This implant results in source and drain regions 72 which areself-aligned to the NMOS gate with a dopant concentration of about5×10¹⁷ and 1×10¹⁹ /cm³. After an oxidation step to grow a cap oxide, ap-type LDD using a dopant such as BF₂ is performed across the surface ofthe bipolar transistor and the PMOS transistor with the source and drainof the PMOS transistor and the base region of the bipolar transistorexposed by a mask. A more heavily doped p-region 74 which isself-aligned to the emitter is formed in the base of the bipolartransistor and a more heavily doped p-region 76 which is self-aligned tothe gate is formed around the gate of the PMOS transistor. The resultingnet dopant concentration in the regions 74 and 76 is between about5×10¹⁷ and 1×10¹⁹ /cm³. The implant energy is preferably between about40 and 60 keV. As shown, more heavily doped well ties are also diffusedfrom the NMOS and PMOS contacts. Also, an emitter region 27b is diffusedfrom the overlying emitter contact 27a and heavily doped extrinsic baseregions are diffused from the base contact.

Referring to FIG. 2p, nitride is stripped from the surface of the deviceand a Low Temperature Oxide (LTO) deposition is performed. A silicideexclusion mask, not shown, is formed on the device on polysiliconregions where silicide formation is not desired (e.g., over the centerportion of the resistor). The oxide is then etched back, leaving spaceroxide on exposed sides of the source contacts, drain contacts, gates,emitters, base contacts, and collector contacts using means known tothose of skill in the art. The mask shown in FIG. 2p is then formed overthe device for protection of at least the sidewall oxide on the bipolaremitter, the gates of the NMOS and PMOS transistors, and the resistor.The device is etched with BOE for about 1 minute and, as shown in FIG.2q, the oxide is removed from the sidewall of the resistor/basecontacts, the collector contacts, and the source and drain contacts ofthe NMOS and PMOS transistors. In alternative embodiments, sidewalloxide is selectively formed on the sidewall of polysilicon according tothe process disclosed in U.S. application Ser. No. 07/503,491 which isincorporated herein by reference for all purposes.

Referring to FIG. 2r, a mask is formed and a heavy p+ (BF₂) implant isperformed in the regions shown therein, i.e., in the region of thesource/drain of the PMOS transistor and the extrinsic base region of thebipolar transistor. The purpose of this implant is to further lower theresistances of the source/drain and extrinsic base regions. The implantuses an energy of between about 40 and 60 keV. Similarly, as shown inFIG. 2s, an n+ (arsenic) implant is performed in the region of thesource/drain of the NMOS transistor for the purpose of forming thesource/drain regions and lowering their resistances. The arsenic implantuses an energy of between about 50 and 100 keV. The device is then,optionally, annealed at a temperature of about 900° to 950° C. for about10 to 30 minutes or at a temperature of 1000° to 1100° C. for about 10to 30 seconds using a rapid thermal annealing process.

Next, a layer of refractory metal such as titanium, molybdenum,tantalum, tungsten, or the like, is deposited across the surface of thedevice. Using means well known to those of skill in the art, the layeris heated to form metal silicide in regions where the deposited metal isin contact with polysilicon. Remaining unreacted metal is then etchedaway from the device, leaving a structure as shown in FIG. 2t. As showntherein, the bipolar polysilicon base contacts are covered with silicide46 across their horizontal upper surfaces, and along their verticalsidewalls. In addition, the silicide contacts extend from the verticalsidewalls along the horizontal upper surface of the single-crystal basefully up to the sidewall oxide of the emitter. The silicide contact 48of the emitter extends across the horizontal upper surface of theemitter contact from one sidewall oxide to the opposite sidewall oxide.The silicide 80 on the collector contact 20 extends up both verticalsidewalls of the collector contact and fully across the horizontal uppersurface of the contact, terminating on the field oxide regions 22b and22c. The silicide 54a on the NMOS polysilicon contact 28 extends fromthe field oxide region 22c, up the vertical sidewall of the contact,across its upper surface, and down the vertical portion of the contactto the single-crystal source region of the NMOS transistor.Additionally, the silicide extends from the contact across thehorizontal upper portion of the source/drain regions to the gatesidewall oxide. Like the bipolar emitter, the polysilicon gate of theNMOS transistor includes silicide 50 across its upper surface whichextends from one oxide sidewall to the opposite sidewall oxide.

The polysilicon well tap 32 also is covered with silicide which coversboth the vertical sidewalls and horizontal upper surface of the contact.Additionally, the silicide extends across the upper surface of thetransistors up to the sidewall oxide of the transistor gates. The PMOSgate includes silicide 52 across its horizontal upper surface, while thePMOS source contact includes silicide 54c across its horizontal uppersurface, its vertical sidewall, and across the horizontal surface of thedrain up to the gate sidewall oxide.

The contact scheme disclosed herein provides reduced source/drainresistance through silicidation of the sidewall polysilicon contactstrap, thereby increasing the current drive capability of the CMOStransistors and eliminating the polysilicon-silicon contact resistance.Reduced polysilicon source/drain to the epitaxial silicon source/drainoverlap is obtained by removing the sidewall spacer oxide andsilicidation of this sidewall, since the current will be carried throughthis sidewall silicide and not through the epitaxial silicon-polysiliconinterface. This provides for a higher packing density through smallerCMOS transistor active areas.

Removal of the spacer sidewall oxide and silicidation of the extrinsicbase polysilicon sidewall will lower the extrinsic base resistance, thuseliminating the problem with the high polysilicon-silicon contactresistance, which enhances the bipolar transistor electricalcharacteristics. The bipolar transistor geometry is reduced bysiliciding the sidewall extrinsic base poly and through reduction of thebase polysilicon to the epitaxial silicon base overlap; consequently, alower extrinsic base junction capacitance is obtained in conjunctionwith a lower extrinsic base resistance. Also, the reduction in thebipolar transistor active area due to the sidewall silicidation alsoreduces the collector-substrate junction capacitance, thereby enhancingthe transistor electrical characteristics. Still further, siliciding ofthe collector sidewall poly for contacting the silicided polysilicon tothe silicided silicon collector will reduce the collector resistance byeliminating the polysilicon to silicon contact resistance. This lowerresistance will allow for scaling of the collector area, and thus areduction in the collector-substrate capacitance and an increase in thepacking density.

It is believed that sidewall silicidation of the local interconnectsimproves the resistance of the interconnect by a factor of 2, therebyenchancing the circuit performance. Silicided polysilicon according tothe invention herein, as applied to a ground top, would reduce theground tap resistance by conducting the current through the silicidedsidewall poly tap to the substrate rather than the doped polysilicon tothe substrate.

FIG. 2u illustrates the next step in the fabrication sequence in whichoxide layer 56 is deposited and masked to form contact holes therein.Metal is deposited on the surface of the device, masked, and etched fromselected regions, providing the device shown in FIG. 2v. In alternativeembodiments the contact holes are filled with tungsten and etched backso as to form a planar surface before deposition of the metalinterconnect layer. Thereafter, additional metallization layers areformed and the device is passivated, providing the structure shown inFIG. 1.

III. Device Performance

Table 1 summarizes the electrical parameters of devices fabricatedaccording to one embodiments of the invention above. Table 1 illustratesthe target CMOS and bipolar electrical characteristics according to oneembodiment of the invention.

                  TABLE 1                                                         ______________________________________                                        BiCMOS Transistor Parameters                                                  ______________________________________                                        CMOS:                                                                         Gate oxide thickness [Å]                                                                          150 ± 15                                           L.sub.eff (n-chanel) [μm]                                                                          0.7 ± 0.15                                         L.sub.eff (p-channel) [μm]                                                                         0.7 ± 0.15                                         Minimum p- and n- gate length                                                                         0.8                                                   n-threshold voltage [V] 0.75 ±0.1                                          p-threshold voltage [V] -0.85 ± 0.1                                        n-channel I.sub.dsat [mA/μm]                                                                       >0.38                                                 p-channel I.sub.dsat [mA/μm]                                                                       >0.17                                                 I.sub.sub (i.e., substrate current) [μA/μm]                                                     1 ± 20%                                            NPN:                                                                          Minimum emitter width [μm]                                                                         0.8                                                   Device area [μm.sup.2 ]                                                                            1.6 × 6.1                                       Current gain            90                                                    E-B breakdown [V]       6                                                     C-B breakdown [V]       16                                                    C-E breakdown [V]       8                                                     ______________________________________                                    

FIG. 3 illustrates a typical I_(c) versus V_(ce) curve for a bipolartransistor fabricated according to one embodiment of the invention. FIG.3 shows that the devices have a high Early voltage.

FIGS. 4a and 4b are subthreshold slopes for 40/0.8 (i.e., width=40 μm,length=0.8 μm) PMOS and NMOS transistors, respectively, for drainvolatges of 0.1 and 5 volts. The transistors have off to on currentratios of better than 6 decades, with leakage currents in the pA rangefor V_(ds) =±5 v.

Table 2 provides actual gate delays for loaded and unloaded CMOS,BiCMOS, and ECL devices fabricated according to one embodiment of theinvention. FIG. 5 illustrates the BiCMOS ring cell used to develop thedata shown in Table 2. Table 2 illustrates that devices fabricatedaccording to the inventions herein provide high performance CMOSdevices.

                  TABLE 2                                                         ______________________________________                                        Ring Oscillator Delays (picoseconds)                                                       No Load                                                                              1 pF Load                                                 ______________________________________                                        CMOS            83      ˜500                                            BiCMOS         120      ˜400                                            ECL            <50       ˜80                                            ______________________________________                                    

It is to be understood that the above description is intended to beillustrative and not restrictive. Many variations of the invention willbecome apparent to those of skill in the art upon review of thisdisclosure. Merely by way of example particular regions of the devicesshown herein have been illustrated as being p-type or n-type, but itwill be apparent to those of skill in the art that the role of n- andp-type dopants may readily be reversed. Further, while the invention hasbeen illustrated with regard to specific dopant concentrations in someinstances, it should also be clear that a wide range of dopantconcentrations may be used for many features of the devices hereinwithout departing from the scope of the inventions herein. Stillfurther, while the inventions herein have been illustrated primarily inrelation to a BiCMOS device, many facets of the invention could beapplied in the fabrication of bipolar transistors, MOSFETs, or otherdevices in isolation. The scope of the invention should, therefore, bedetermined not with reference to the above description, but insteadshould be determined with reference to the appended claims along withtheir full scope of equivalents.

What is claimed is:
 1. A method of making a contact structure in asemiconductor device, the semiconductor device comprising a substrate, afirst polysilicon region on the substrate, and a second polysiliconregion on the substrate, comprising the steps of:a) forming oxidesidewalls on said first and said second polysilicon regions; b)protecting at least one sidewall of said first polysilicon region, saidat least one sidewall between said first polysilicon region on saidsubstrate and said second polysilicon region on said substrate; c)removing unprotected sidewall oxide to leave oxide remaining on said atleast one sidewall; d) forming a metal layer on an upper surface of saidsemiconductor device and said first and second polysilicon regions; e)heating said metal layer so as to form metal silicide where said metalis in contact with silicon; and f) removing unreacted metal so as toleave a silicide contact extending over at least an upper surface ofsaid second polysilicon region and a first sidewall of said secondpolysilicon region.
 2. The method as recited in claim 1 wherein saidstep of removing also leaves silicide on said substrate between saidfirst sidewall of said second polysilicon region and said oxideremaining on said at least one sidewall.
 3. The method as recited inclaim 1 wherein the step of protecting is a step of forming a mask. 4.The method as recited in claim 1 preceded by the step of forming anoxide region between said first polysilicon region and said substrate,said first polysilicon region, said oxide region between said firstpolysilicon region and said substrate, and said substrate forming ametal, insulator, semiconductor device.
 5. The method as recited inclaim 2 further comprising the step of doping said substrate betweensaid first sidewall of said second polysilicon region and said oxideremaining on said at least one sidewall to a first conductivity type,said substrate below said oxide region between said first polysiliconregion and said substrate comprising monocrystalline silicon of a secondconductivity type.
 6. The method as recited in claim 2 furthercomprising the step of providing said substrate below said firstpolysilicon region with a dopant of a first conductivity type, saidfirst polysilicon region comprising monocrystalline silicon of a secondconductivity type.